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A hardening depth evaluation technique using eddy current has been developed, which can be applied to a mass production line for destructive (cutting) inspections. Using this technique, changes in the hardness of the induction-hardened structure can be detected based on the changes in magnetic permeability. This technique reduces the thermal effect and improves measurement accuracy through a multi-frequency exciting method and a difference method algorithm.

We have developed a Hall effect device based height sensor of a smaller size, and with higher temperature operation durability, as compared to conventional devices. Downsizing of the sensor is realized by decreasing a number of parts, and by employing a short bearing. Improvement in heat resistance is achieved by adopting an IC with sufficient heat resistance and a SmCo magnet with high coercive force. In addition, a sensor of a high degree of accuracy is accomplished by improvements in linearity and robustness of magnetic characteristics. Development of a small, heat-resistant and accurate height sensor will promote the spread of systems using a height sensor, such as a High Intensity Discharge (HID) headlamp.

The dissolution and exfoliation of chromium plating specific to Russia was studied. Investigation and analysis of organic compounds in Russian soil revealed contents of highly concentrated fulvic acid. Additionally, it was found that fulvic acid, together with CaCl2 (a deicing agent), causes chromium plating corrosion. The fulvic acid generates a compound that prevents reformation of a passivation film and deteriorates the sacrificial corrosion effectiveness of nickel.

The use of lead-free (Pb-free) solder and plating in onboard electronic components has accelerated rapidly in recent years, but solutions have yet to be found for the issues of whisker generation in tin (Sn) plating and crack initiation in Pb-free solder, despite widespread research efforts. Analysis of the whisker generation mechanism has focused on internal energy levels and crystal orientation, and analysis of the crack initiation mechanism in Pb-free solder has examined changes in the grain boundaries of Sn crystals.